These chips will be part of new blade server systems from Dell, Fujitsu-Siemens, and other major OEMs scheduled to be released later this year. System pricing will vary by manufacturer.
According to Intel, these dual-processor systems contain a Low Voltage Intel Pentium III processors at 800 MHz and can offer up to 63 percent higher performance than a similar system with a single processor. Intel is also offering a variety of new server-centric improvements that include large memory support of up to 4 GB.
"Today's announcement for dual-processing in 'ultra-dense' servers increases the capabilities for this emerging market segment," said Richard Dracott, director of Intel's Enterprise Platforms Group. "These systems offer significant real estate, performance, and power benefits vs. single processor systems."
Each processor inside of the new dual-processor systems contains 512 KB of on-chip level 2 cache memory. They are also the first Intel-based "ultra-dense" dual processing chips to support faster PC 133 SDRAM memory and a 133 MHz system bus.
They also contain reliability features such as error correcting code and remote manageability tools.
Because of their dual processing configurations, the new platforms were tested in Intel's enterprise validation labs. The processors are produced in large volumes using Intel's 0.13-micron manufacturing process, an advanced process that enables low voltages. The chips come in Intel's uFCBGA package, a packaging technology for smaller systems, such as high-density servers.
Intel entered the blade market arena last fall when it announced processors and chipsets for ultra-low voltage single-processor blade systems. These initial systems offer low voltages and speeds, and brought server-centric features to ultra-dense blades, including large memory support (up to 2 GB) and error correcting code. OEMs, including Compaq and Hewlett-Packard, have announced systems based on this platform.
With Tuesday's announcement, Intel's blade portfolio is complete.